Layer:1~22 layers
Materials: FR-4, CEM-3, Teflon, Aluminum, Rogers, High Tg
Surface finished:Lead Free HASL,Immersion Gold/Tin/Silver, OSP, Gold Finger Plating, Selective Immersion Gold,Gold Plating
|
|
|
English |
Metric |
1 |
Max. Panel Size |
|
22" x 26" |
550 x 650mm |
2 |
Mechanical Drill |
|
|
|
|
Min. Finished Holes Size |
|
0.004" |
0.10mm |
|
Finished Holes Tolerance |
PTH |
±0.003" |
±0.075mm |
|
|
NPTH |
±0.002" |
±0.050mm |
|
|
Press Fit |
±0.002" |
±0.050mm |
|
Aspect Ratio |
|
9 : 1 |
9 : 1 |
3 |
Laser Drill |
|
|
|
|
Microvias diameter |
|
0.004" - 0.006" |
0.10 - 0.15mm |
|
Aspect Ratio |
|
1 : 1 |
1 : 1 |
4 |
Min. Line Width/Spacing |
½oz / 18um |
0.003" / 0.003" |
0.075 / 0.075mm |
|
|
1oz / 35um |
0.006" / 0.006" |
0.15 / 0.15mm |
|
|
2oz / 70um |
0.008" / 0.008" |
0.20 / 0.20mm |
|
|
3oz / 105um |
0.010" / 0.010" |
0.25 / 0.25mm |
5 |
Registration |
|
|
|
|
Solder Mask |
|
±0.003" |
±0.075mm |
|
Layer to Layer |
|
±0.0024" |
±0.060mm |
|
Copper Feature to Holes(Outer) |
|
±0.003" |
±0.075mm |
|
Min. Plated Drills to Copper (inner) |
2L - 8L |
0.010" |
0.25mm |
|
|
10L -22L |
0.012" |
0.30mm |
6 |
Board Outline |
|
|
|
|
Edge to Edge Tolerance |
|
±0.004" |
±0.10mm |
|
Holes to Edge Tolerance |
|
±0.004" |
±0.100mm |
|
Min. Copper to Edge distance |
Outer |
0.010" |
0.25mm |
|
|
Inner |
0.016" |
0.40mm |
7 |
Max. Copper Thickness |
|
4oz |
140μm |
8 |
Max. Board Thickness |
|
0.189" |
4.80 mm |
9 |
Min Board Thickness |
2L |
0.008" |
0.20mm |
|
|
4L |
0.016" |
0.40mm |
|
|
6L -22L |
0.020" |
0.60mm |
10 |
Min. Core Thickness |
|
0.004" |
0.10mm |
11 |
Min. Soldermask Dam |
0.004" |
0.10mm |
12 |
Controlled Impedance (Ohm) |
±7% - 10% |
±7% - 10% |
