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  • PCB news
  • Development trend of ceramic based circuit board
     
    Date :2017-5-25

     

    Abstract: with the LED industry to pick up, and the PCB market soaring, the trend of a good situation, with what to keep up with the general trend is worth every entrepreneur thinking.


    2017, the first quarter has gone quietly, due to the development of smart cars, PCB plate experienced a round of gains, it is understood that PCB plate in this round of price increases, prices rose 5% again. As the new production capacity of electrolytic copper foil will take 2-3 years, it will be a normal situation for CCL and PCB to be short of copper foil in the next 1-2 years. Not only raw materials in short supply, according to market news, from the beginning of the first quarter of 2017, PCB industry from upstream equipment factory, raw materials factory to the downstream manufacturers are showing off-season performance. For now, the PCB industry will continue to force.


    And because of its high thermal conductivity, strong adhesion and high frequency loss, the ceramic circuit board is widely used in LED industry and the development of ceramic circuit board, which is closely related to LED.


    2017, the first quarter of the LDE display of major listed companies performance notice has been released. At the same time, the six major LED display companies did not relax their pace, are in the direction of their own goals. Throughout the domestic performance report shows that, whether it is operating income or net profit has increased considerably, for the second half of 2017, the development of enterprises is a good beginning.


    Chau Ming Technology 2017 first quarter results notice that the company expects 2017 1-3 months net profit of 48 million yuan ~5200.00 yuan, compared to 20 million 164 thousand and 500 yuan a year earlier, an increase of 138.04%~157.88%.


    A quarterly report released in 2017 that Riyadh, the company achieved operating income of 1 billion 128 million yuan, an increase of 39.69%; net profit of 172 million yuan, an increase of 110.59%; earnings per share of 0.21 yuan.


    Alto Electronics announced a quarterly profit of 7 million yuan to 10 million 250 thousand yuan, while over the same period last year profit of $-659.31 million. At the same time, alto electronics has released the first half of 2017 results notice, the company expects 2017 1-6 month net profit of 52 million 500 thousand yuan to 66 million yuan, 27 million 341 thousand yuan a year earlier, an increase of 92.02% to 141.40%.


    According to a quarterly photoelectric released show that in 2017, the company achieved operating income of 704 million yuan, an increase of 90.33%; net profit of 73 million 235 thousand and 200 yuan, an increase of 28.82%; earnings per share of 0.12 yuan.


    Lehman photoelectric Lehman shares in April 8th released in 2017 a quarterly results notice, the company expects 2017 1-3 months net profit of 6 million 38 thousand and 400 yuan to 9 million 57 thousand and 600 yuan, 10 million 64 thousand yuan over the same period last year, down 40% to 10%.


    Abison 2017 first quarter results notice shows that the company expects 2017 1-3 months net profit of 11 million 700 thousand yuan to 13 million 500 thousand yuan, 22 million 498 thousand and 900 yuan over the same period last year, down 48% to 40%.


    To sum up, in 2017, the LED display industry had a good start in the first quarter. As the LED display industry weathervane listed companies, in the first quarter performance forecast has given gratifying results, this indicates that the LED display industry in 2017 will usher in a steady upward momentum. With ceramic circuit board another is closely related to the packaging industry, ceramic super high thermal conductivity is undoubtedly excellent material packaging.


    2015 advanced packaging market (including SiP, WLP and TSV, etc.) 12 inches equivalent wafers up to 25 million, accounting for 32% of the industry. Expect steady growth from 2015 to 2019, to 37 million, accounting for 38% of the industry. To 2020, the global advanced packaging market 12 inches equivalent wafer to 32 billion pieces, China advanced packaging output increased to 8 million pieces. In 2014, the global advanced packaging market reached 20 billion 150 million U. s.dollars, of which Flip-chip accounted for 84%, Fan-Out packaging accounted for 1%. High-end Fan-Out packaging in advanced packaging, the proportion will increase to 8% in 2020.


    Supported by the national integrated circuit industry support policy, by 2020, the domestic IC industry will maintain a growth rate of CAGR 20%. At the same time, strengthen the global mergers and acquisitions of local IC packaging enterprises, not only brings a lot of advanced packaging technology and intellectual property, but also makes the international customers gradually shifted to the mainland. In recent years, the international packaging giant IC plus ankura etc. in a large number of investment in the mainland, China's advanced IC packaging industry is expected to maintain the growth rate of not less than 18% of CAGR growth, is expected by 2016 4 billion 150 million to 2018 5 billion 700 million yield. In 2020, the domestic advanced packaging industry will reach 4 billion 600 million U. s.dollars.


    Source: PCB information network

     

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