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  • Three kinds of PCB process engineering
    Date :2017-4-2

    SP: SP is the earliest traditional process, is also the manufacturing process of mature application, using light to complete the pattern transfer and the corrosion resistance of materials, material to protect the area without etching, followed by acidic or alkaline etching liquid copper layer will not protect regional removal.

    In the subtractive process, the biggest disadvantage lies in the etching process, the bare copper layer in the process of etching down to side etching (i.e. side etching), the lateral erosion exists, reducing application in fine line production in the process is very limited, when the line width / spacing less than 50 m (2mil) when because the yield is too low, minus has been useless. At present, the subtractive method is mainly used for the production of ordinary PCB, FPC, HDI and other printed circuit board products.


    SAP: full additive process using an insulating substrate containing photosensitive catalyst, in line graph after exposure by selective chemical deposition of copper conductor pattern.The additive process is more suitable for the production of fine lines, but because of its substrate, electroless copper has special requirements, different from the traditional PCB manufacturing process, high cost and technology is not mature, production is not present. The method can be used for production of WB or FC chip on board, the process can reach 12 mu m/12 mu m.


    MSAP: MSAP based on how to overcome the respective reduction method and the additive in fine line manufacturing problem. Semi additive for electroless copper on the substrate and the resist pattern formed thereon, after plating on the substrate to remove the resist pattern thickening pattern, and then remove the excess chemical copper layer after flash etching, dry film protection no electroplate area in the differential etching process is very fast the removal of the remaining part of the formation of the line.


    MSAP is characterized by the formation of graphics mainly by electroplating and flash erosion. In the process of flash etching, the etching time is very short because of the very thin copper layer.

    Compared with the reduction method, the line width is not affected by copper plating thickness, easy to control, with higher resolution, the production of fine line width and line distance is almost the same, greatly improve the rate of finished products. Semi additive method is the main method for the production of fine lines, production capacity can reach the minimum line width / spacing of 14 m/14 m, the minimum aperture of 55 m, manufacturing is widely used in CSP, WB and FC flip chip substrate and fine circuit board.


    The carrier plate belongs to the class of printed circuit board, but in the process, the minimum line width / spacing is 30 mu m/30 mu m, not by subtractive production, also need to use the MSAP process technology.


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