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  • Development of PCB manufacturing technology for 50 years
    Date :2010-4-30


    1, PCB was born on: 1936 ~ (Manufacturing method: Addition)


        On the first to know "PCB" in 1948, when entering the Tokyo Shibaura Electric Co., Ltd. has just two years, new employees, opened an investigation directed by the section chief, "Printed Circuit Board." View of the United States to allow Japanese troops library access, accidentally discovered the "printed circuit technology" as the title of technical papers. There was no photocopier, need only a pen copying documents, papers all around 200 pages, detailing the smear, spray, vacuum deposition, evaporation, chemical deposition method, coating method and other techniques described Add insulation boards are conductive materials to form the surface of conductor graphics, known as the "addition law process." Patented the use of such production by the end of 1936 when the PCB used in radio receivers.


    2, PCB trial production period: 1950 ~ (Manufacturing method: Subtractive)


        On entering the Oki Electric Industry Corporation 1 year after the communications equipment industry since 1953 starting to focus on PCB manufacturing methods is the use of paper-based phenolic resin copper clad laminate (PP substrate), using chemicals to remove unwanted dissolved copper foil, leaving the copper foil into the circuit, called "Subtractive process." In some signs manufacturing plant using this process try to do PCB, mainly manual, etching solution is ferric chloride, spilled onto the clothes will turn yellow. Application of PCB was representative products are manufactured cable fart portable transistor radio, should one side and the PP substrate PCB. Japan published in 1958 the title "printed circuit" of the first books about the Enlightenment PCB.


    3, PCB practical period: 1960 ~ (new material: GE substrate debut)


        1955 Raytheon Company and the United States for technical cooperation, to create "marine radar." Raytheon Company to apply the specified PCB copper clad epoxy glass cloth laminated sheet (GE substrate). GE matrix was developed in Japan and completed the localization of new materials, to achieve mass production of domestic marine radar. 1960 Oki Electric companies began mass production of electric transmission system in a large number of PCB substrate materials used in GE.
    1962 Japan "Printed Circuit Industry" was established. 1964 U.S. light circuit has developed SHEN Hou copper electroless copper plating solution (CC-4 solution), starting a new Addition PCB manufacturing process. Hitachi Chemical Company introduced CC-4 technology. GE used PCB's domestic heating substrate warpage in the early stages, copper strip and so on, materials manufacturers gradually improved and enhanced since 1965 with several Japanese manufacturers began mass production of GE material substrate, industrial electronic equipment GE substrates, consumer electronics equipment PP substrate, has become common knowledge.


    4, PCB fall into the period: 1970 ~ (MLB debut, the new installation soon)


        companies, communications equipment manufacturers set up their PCB manufacturing facilities, and PCB manufacturing company is also rapidly rising. At this time, began to realize by plating through hole PCB interconnection between the layers. In 1972 and 1981 and 10 years, the Japanese PCB production grew about 6 times the amount (value of 47.1 billion yen in 1972, output value of 302.1 billion yen in 1981), is the record of the Great Leap Forward.
    Telecommunications companies since 1970, the electronic switches used in 3-layer PCB with PCB, multilayer PCB used in subsequent large-scale computer (MLB), thus be reused and the rapid development of MLB, MLB more than 20 layers with polyimide amine resin laminate as the insulating substrate. This period from 4 layers PCB layer to 6,8,10,20,40,50 ... more layer development, and implementation of high-density (thin, small holes, thin plate technology), line width and spacing from 0.5mm development to 0.35,0.2,0.1 mm, PCB wiring density per unit area increased significantly.
    PCB components installed on the way to start a revolutionary change, the original plug-in installation technology (TMT) changed to Surface Mount Technology (SMT). Lead PCB plug-in installation method in the application of more than 20 years, and also rely on manually, and then also developed automatic component insertion machines, automated assembly line. SMT is automatic assembly line, and to achieve PCB mount components on both sides.

    5, MLB leap period: 1980 ~ (high-density equipment installed soon)


        1982 to 1991 in the 10 years, the Japanese PCB production value increased by 3 times (1982, output value of 361.5 billion yen, in 1991 1.094 trillion yen). MLB 1986, when the output value of 146.8 billion yen, to catch up with single-sided output; to 1989, 278.4 billion yen, nearly two-panel output, since the dominant of the MLB.
    PCB after 1980 significantly increased high-density technology, has produced 62 layers of glass ceramic matrix MLB, MLB to promote higher density development of competition in mobile phones and computers.


    6, in the 21st century run-up period: 1990 ~ (active layer method MLB debut)


        After 1991, Japanese economic bubble burst, the affected electronic equipment and PCB decreased after 1994 began to recover, MLB, and flexible boards with large growth, while single-sided and double-panel production began to decline along. 1998 MLB laminated into the utility of law, the rapid increase in production, IC component packages into the plane array BGA termination type and CSP, to smaller, high density of installation.


    Future Prospects


        PCB tremendous development and changes over 50 years. Since 1947, since the invention of semiconductor transistors, electronic equipment morphogenetic big change, the semiconductor by the IC, ISI, VLSI, ... to the development of highly integrated, developed MCM, BGA, CSP and other more integrated IC. The early 21st century technology trend is for the equipment, high-density, miniaturization and light weight work, innovation and technology driven 21st century will be "nanotechnology" will drive research and development of electronic components.


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